We possess the technical capabilities of MSAP (Modified Semi-Additive Process), SAP (Semi-Additive Process), and AnyLayer technology.
By 2024, we aim to achieve the technical capability and deliver samples of FC CSP products with 2-6 layers and line widths/space of 12μm/12μm.By 2025, we aim to achieve the technical capability and industrialization of FC CSP products with 2-6 layers.
