ZIBO XINCAIIC CO., LTD., established in 2021 with a registered capital of 45.2892 million yuan, is a specialized enterprise dedicated to the research, development, and production of high-end integrated circuit packaging substrates. The company’s primary products include FC-CSP (Flip Chip Chip Scale Packaging) and FC-BGA (Flip Chip Ball Grid Array Packaging), which are extensively utilized in critical packaging applications such as 5G communications, AI chips, and automotive electronics. The company holds 73 independent intellectual property rights, comprising 13 invention patents and 31 software copyrights. It has been recognized as a major project by both Shandong Province and Zibo City, undertaken the Shandong Provincial Key Research and Development Program (Major Technological Innovation Project), and is the sole enterprise from Zibo to be included in the National Key Private Investment Project Library. Furthermore, the company has been honored with the title of Outstanding Enterprise in the Shandong Division of the China Innovation and Entrepreneurship Competition.

      In the field of packaging substrates, ZIBO XINCAIIC packaging substrate project represents a total investment of 3.5 billion yuan, covering an area of 150 mu with a construction area of approximately 150,000 square meters. The project is being developed in two phases. The first phase has successfully completed the construction of infrastructure, including the factory and R&D center, as well as the installation of the FC-CSP production line, achieving the production of FC-CSP products with a line width/line spacing of 12μm/12μm. The second phase will focus on the establishment of an FC-BGA production line with a line width/line spacing of 6μm/6μm. Upon completion, the company will possess the most advanced FC-CSP and FC-BGA production and testing technologies in China, thereby addressing the domestic bottleneck in chip packaging materials and achieving localization substitution.