1. By 2024, we aim to achieve the technical capability and deliver samples of FC CSP products with 2-6 layers and line widths/space of 12μm/12μm. Additionally, we will have the technical capability for FC BGA products with 8-12 layers and line widths/space of 10μm/10μm.

2.By 2025, we aim to achieve the technical capability and industrialization of FC CSP products with 2-6 layers and line widths/space of 10μm/10μm. Additionally, we will have the technical capability and deliver samples of FC BGA products with over 16 layers and line widths/space of 8μm/8μm.