With capabilities in MSAP, SAP, and anylayer technologies, it supports the production of FC CSP products with 2-6 layers, achieving line width/pitch of 10μm/10μm, as well as FC BGA products with over 16 layers, reaching a line width/pitch of 8μm/8μm. Specifically, this entails: blind hole filling recess for 50μm holes ≤5μm, extremely uniform electroplating ≤6μm, interlayer alignment accuracy ≤15μm, and exposure resolution line width/pitch ≤8μm/8μm. This culminates in the technical capability and industrialization for producing these advanced packaging products.