ZIBO XINCAIIC CO., LTD.  in collaboration with Jiangxi University of Science and Technology, Shandong Academy of Sciences Laser Institute, and industry-leading enterprises, has successfully secured approval for the "High-Performance FC-BGA Substrate Research and Industrialization" project as part of the 2024 Shandong Province Key Research and Development Program (Major Scientific and Technological Innovation Projects). This significant breakthrough signifies that our company's technological innovation capabilities in the field of high-end packaging substrates have been highly recognized at the provincial level.

The Shandong Province Key Research and Development Program (Major Scientific and Technological Innovation Projects) is an integral part of the province's scientific and technological innovation system. It focuses on supporting key areas such as the transformation and upgrading of traditional industries, the cultivation and expansion of strategic emerging industries, and the frontier leadership of future industries. The program centers around major breakthroughs in key technologies, the development of innovative products, and the demonstration of technology transfer and commercialization. It aims to promote significant advancements in critical common technologies, cutting-edge leading technologies, modern engineering technologies, and disruptive innovations, providing strong technological support for accelerating the formation of new productive forces and building a modern industrial system.

As the lead organization of the project, our company will leverage its accumulated technological expertise and industrialization advantages in the field of high-end packaging materials. We will work closely with all collaborating partners to overcome the core technical bottlenecks in FC-BGA substrates. The project team will adhere to the philosophy of "innovation-driven and quality-first," focusing on key technical challenges such as optimizing material systems and innovating precision manufacturing processes to ensure that the research outcomes reach international advanced levels. Additionally, this project will serve as an opportunity for us to further improve the collaborative innovation mechanism involving industry, academia, research, and application, accelerating the pace of technology transfer and commercialization. We aim to make significant contributions to the high-quality development of China's integrated circuit packaging materials industry.

In the future, our company will continue to pursue an innovation-driven development strategy, focusing on high-end packaging materials. We will consistently increase investment in R&D, strengthen our independent innovation capabilities in core technologies, and strive to develop internationally competitive products. Our aim is to provide strong support for the autonomous control and high-quality development of China's integrated circuit industry chain.