On November 10, the groundbreaking ceremony for the first section of the Zibo Integrated Circuit Packaging Substrate (Phase I) project, undertaken by China Construction Installation Co., Ltd. (First Company), officially took place. Attendees included Zhu Guoqi, Chairman of Zibo Xincai Integrated Circuit Co., Ltd., Zhang Ruolian, Chief Commander of the Phase I Engineering Site for the Integrated Circuit Packaging Substrate Project, Liu Yinglei, Party General Branch Secretary and Manager of the Petrochemical Branch of China Construction Installation Co., Ltd. (First Company), Deputy Manager He Shenggang, and other relevant personnel.